JPH04788B2 - - Google Patents

Info

Publication number
JPH04788B2
JPH04788B2 JP60113689A JP11368985A JPH04788B2 JP H04788 B2 JPH04788 B2 JP H04788B2 JP 60113689 A JP60113689 A JP 60113689A JP 11368985 A JP11368985 A JP 11368985A JP H04788 B2 JPH04788 B2 JP H04788B2
Authority
JP
Japan
Prior art keywords
grinding
ground
wheel
abrasive grains
dressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60113689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61270078A (ja
Inventor
Teruhiro Nakamura
Katsumi Uesugi
Ryozo Kikuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP11368985A priority Critical patent/JPS61270078A/ja
Publication of JPS61270078A publication Critical patent/JPS61270078A/ja
Publication of JPH04788B2 publication Critical patent/JPH04788B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP11368985A 1985-05-27 1985-05-27 研削盤における研削方法 Granted JPS61270078A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11368985A JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11368985A JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Publications (2)

Publication Number Publication Date
JPS61270078A JPS61270078A (ja) 1986-11-29
JPH04788B2 true JPH04788B2 (en]) 1992-01-08

Family

ID=14618686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11368985A Granted JPS61270078A (ja) 1985-05-27 1985-05-27 研削盤における研削方法

Country Status (1)

Country Link
JP (1) JPS61270078A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5450946B2 (ja) * 2007-09-27 2014-03-26 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの両面研磨方法
JP6345564B2 (ja) * 2014-09-30 2018-06-20 株式会社ノリタケカンパニーリミテド 砥石及び砥石製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52165493U (en]) * 1976-06-09 1977-12-15
JPS5941009Y2 (ja) * 1981-04-01 1984-11-24 有限会社応用磁気研究所 研削用円盤

Also Published As

Publication number Publication date
JPS61270078A (ja) 1986-11-29

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